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Development and characterization of plasma etching processes for ...

V? ETCHING AND ETCHERS. Page 8. Page 9. ETCHI.



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METHOD FOR IMPROVING UNIFORMITY AND REDUCING ETCH ...
stabilization since deposition on the edge ring can alter H and Br recombination which causes etch rate drift. The reactor can include any suitable source ...
Characterization and optimization of high density plasma etching ...
Etching with HBr implies low etch rate and the formation of residues on the wafer and the chamber walls. But, as Chang et al proposed [206] ...
Fabrication Technology - Wiley-VCH
In addition, a 'blank' reticle is used to remove the metal around the edges of the wafer in order to avoid short circuits in the etch network at the wafer edge.
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